MediaTek remains the top smartphone chip brand for seven consecutive quarters

Taiwanese chip maker, MediaTek remains on top of its game in the smartphone chip market. Popular market research agency, CounterPoint, has released its report for the first quarter of 2022. MediaTek retains its top position in terms of share and development trends. In terms of shipments, MediaTek’s global market share of smartphone chips is 38%. With this figure, the company ranks first. This is also the seventh consecutive quarter that the company is retaining its top position.

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Qualcomm is in the second position with a 30% market share while Apple is third with a 15% market share. UNISOC, Samsung and HiSilicon rank fourth, fifth and sixth respectively with 11%, 5%, and 1% market shares respectively.

MediaTek steadily dominates the mid-range mobile phone market with the Dimensity 700 and Dimensity 900 series. Its 5G chip shipments also record a blistering high-speed month-on-month growth of 20%. At the same time, the Dimensity 9000 series hit the high-end market, bringing more revenue to MediaTek.

Chip sale performance in the U.S.

In addition, CounterPoint also announced the trend chart of smartphone SoC sales in the U.S. market in the past year. It can be seen from the figure that MediaTek has a strong momentum, and its share in April 2021 is only 30%. This is less than half of Qualcomm’s 66%, and it took only one year to reach a record 45%, an increase of 45%.

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If this trend continues, MediaTek will soon be able to overtake Qualcomm. An important factor in MediaTek’s success in the United States is that it has won orders for Samsung Galaxy A12 And Galaxy A32 5G mobile phones. These smartphones have collectively sold 9 million units. In addition, MediaTek also has orders for the Samsung Galaxy A03s, Galaxy A13 5G, Moto G Pure, and Moto G Power.

Analysts also believe that MediaTek’s recently released first 5G millimeter-wave chip, the Dimensity 1050, will also help MediaTek improve its competitiveness in the mid-to-high-end market in the United States.

It adopts TSMC’s 6nm technology and the Sub 6GHz band supports 3CC three-carrier aggregation. In addition, the millimeter-wave high-frequency band supports four-carrier aggregation.

As the Dimensity 9000 series and the Dimensity 8000 series have gained a firm foothold in the flagship and sub-flagship markets. These chips will continue to lead and even expand their leading edge in the global smartphone SoC market.

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